GF AgieCharmilles’ HEM 800

GF AgieCharmilles’ new MIKRON HEM 800 is a three-axis vertical machining centre suitable for production of medium to large-sized parts for industries such as aerospace, electronics and mold and die.

The machine is one of five machines in the company’s High Efficiency Machining Series.

The MIKRON HEM 800 has a 41.34” x 22.05” (105cm x 56cm) work table with a maximum payload of 1,760 lbs (798kg). Maximum X-Y travels measure 33.46” and 20.87” (87.8cm and 52.9cm), respectively, with a Z-axis that provides 23.62” (60cm) of clearance between the table surface and spindle nose. Rapid traverse rate for the X, Y and Z axes is 1,181 ipm.

The oversized table offers enough surface area to safely clamp machined workpieces. The table’s T-slots, with 3.94” (10cm) spacing between each one, permit flexible part fastening and quick alignment to the machine movements.

The machine’s 12.75-hp, 14,000-rpm, CAT 40 spindle generates 31 ft-lbs of torque and enables high-powered milling and drilling operations in the Z-axis. The generously sized spindle motor provides uninterrupted production both with high torque at low speeds and high power at high speeds.

During operations, a closed internal coolant circuit stabilizes and controls temperature drifts of the machine’s spindle head.

The MIKRON HEM 800’s side-mounted automatic tool changer has a capacity for 30 tools and allows for faster uninterrupted production. GF AgieCharmilles kept the tool changer separate from the working area to protect the tools from chip contamination.

Because high-performance machining yields large amounts of chips, the company designed the machine with sharply inclined sidewalls combined with flushing systems that direct chips straight to the evacuation channels.

Chip conveyors then efficiently transport the chips out of the work area. Two adjustable high-flow coolant nozzles and air blow-off nozzles ensure good lubrication of the cutting edge, prevent premature tool wear and enhance machining accuracy, as well as facilitate efficient chip evacuation.